SOME BASIC PROBLEMS IN VLSI INTERCONNECT.

This paper examines some of the basic problems in interconnect for very large scale integration. The nature of the problem is explored by projecting, based on the trend of device scaling, the future demands on the functional requirements of the interconnects. This brings into focus two areas of concern: wiring complexity and metallization requirements. The origin of the wiring complexity and its implication on VLSI interconnect structure are discussed. The problems in metallization arise from increasing demands for device performance and reliability. This is illustrated by problems related to contacts resistance and electromigration. An attempt is made to assess some of the approaches available in meeting these challenging problems. (Edited author abstract. )