Post-Si CMOS: III-V n-MOSFETs with high-k gate dielectrics
Yanning Sun, S.J. Koester, et al.
CS MANTECH 2007
An innovative and simple method, based on electron-beam (e-beam) overlapping and overexposure techniques, is developed to fabricate sub-10 nm electrode gaps with very good electrical properties. Gaps with 4 to 10 nm spacing can be fabricated using a proper e-beam dose and pattern-developing time. The fabrication yield is nearly 100% for 8-9 nm gaps, but significantly smaller for 3-4 nm gaps. The gap leakage resistance is around 10 12-1013, implying very good isolation. As an example, we present a transport study on a single 8 nm Co particle junction using a 10 nm gap. © 2002 American Institute of Physics.
Yanning Sun, S.J. Koester, et al.
CS MANTECH 2007
D. Fried, J. Hergenrother, et al.
IEDM 2004
R. Cao, F. Bozso, et al.
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
K. Liu, Ph. Avouris, et al.
Physical Review B - CMMP