Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperCrystal structure and cation distribution of MnCrInS4 from synchrotron powder diffraction dataG. Will, N. Masciocchi, et al.Zeitschrift fur Kristallographie - New Crystal Structures
PaperAb initio molecular dynamics simulation of liquids and solutionsMichiel SprikJournal of Physics Condensed Matter
