Publication
Thin Solid Films
Paper

R.F. diode sputtering

View publication

Abstract

A review of r.f. sputtering principles is presented with reference to recent plasma models and sample calculations. Typical modern sputtering equipment is described and methods of measurement of important process variables. Application to the sputtering of SiO2 is described, with data on film properties as a function of bias, rate and oxygen additions. © 1990.

Date

15 Jul 1990

Publication

Thin Solid Films

Authors

Topics

Share