PaperTwo-Phase Cooling System Performance Under Different Operating ScenarioPritish Parida, Timothy ChainerITherm 2025
TalkThe Cost of Flexibility and Security in Cloud-Based HPC - A Case Study Running EDA Workloads With Confidential Computing TechnologyMengmei Ye, Derren DunnSC 2023
Conference paperSubtractive Ru Interconnect Enabled by Novel Patterning Solution for EUV Double Patterning and TopVia with Embedded Airgap Integration for Post Cu Interconnect ScalingC. J. Penny, Koichi Motoyama, et al.IEDM 2022