KeynoteInnovative Chiplet Integration Technologies for HPC and AI Hardware SystemsGriselda BonillaiTHERM 2023
PosterModelling Performance and Energy Efficiency of AI and HPC Workloads in Heterogeneous EnvironmentsVadim Elisseev, Edward Taylor, et al.CASCON 2024
Conference paperA high-performance embedded DSP core with novel SIMD featuresJeff H. Derby, Jaime H. MorenoICASSP 2003
PaperThe high-speed networks of the Summit and Sierra supercomputersC. B. Stunkel, R. L. Graham, et al.IBM J. Res. Dev