J.K. Gimzewski, T.A. Jung, et al.
Surface Science
We present a method to pattern an electroless-deposited metal layer based on electroplating a mask and patterning this mask using microcontact printing (μCP) and wet etching. This method starts by derivatizing a glass substrate with an amino-functionalized silane, 3-(2-aminoethylamino)propyltrimethoxysilane (EDA-Si) from solution and using the amine functions of the grafted silane to immobilize Pd/Sn colloids from an acidic suspension onto the glass. The Pd/Sn colloids initiate the electroless deposition (ELD) of a 150 nm thick NiB layer onto the glass. The as-deposited NiB has a specific resistivity of 22 μΩ cm and can be covered with 50 nm of an electroplated Cu layer. Microcontact printing a protective monolayer of eicosanethiol (ECT) onto the Cu and etching it selectively with a cyanide-based etch bath defines the pattern of the Cu mask. This pattern is transferred into the NiB underlayer using a sulfuric acid-based wet etch. The ECT monolayer, the Cu mask, and the Pd/Sn residue remaining on the glass were all removed, yielding the NiB structures. Every step was monitored with X-ray photoelectron spectroscopy (XPS) and the NiB structures were characterized using atomic force microscopy (AFM). Although it comprises a large number of steps, this patterning method is simple and yields high-quality NiB patterns. This method generalizes μCP to metals that are not directly printable, and it could be used instead of vacuum-depositing a metal and patterning it using photolithography.
J.K. Gimzewski, T.A. Jung, et al.
Surface Science
Andreas C. Cangellaris, Karen M. Coperich, et al.
EMC 2001
J.A. Barker, D. Henderson, et al.
Molecular Physics
T.N. Morgan
Semiconductor Science and Technology