Publication
ECTC 2015
Conference paper

Organic Multi-Chip Module for high performance systems

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Abstract

In this work, IBM Research and NTK Technologies have explored the development of an organic Multi-Chip Module (MCM) solution, with the goal of developing innovative technologies that address the requirements of high performance systems. A 90 × 90 mm organic MCM was designed, fabricated, and assembled with dual side mountable 24 × 28 mm thermal test chips mounted on chip-scale interposers to enable functional screening and rework process. The work demonstrated that a large scale organic MCM was compatible with LGA sockets with over 6000 contacts.

Date

15 Jul 2015

Publication

ECTC 2015

Authors

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