Opportunities and challenges for 3D systems and their design

Philip Emma; Eren Kursun

doi:10.1109/MDT.2009.119

IEEE Design and Test of Computers

Paper

06 Nov 2009

Opportunities and challenges for 3D systems and their design

View publication

Abstract

Editor's note article presents the system design opportunities offered by 3D integration, and it discusses the design and test challenges for 3D ICs, with various new design-for-manufacture and DFT issues. © 2009 IEEE.

Conference paper

Thermomechanical stress-aware management for 3D IC designs

Qiaosha Zou, Tao Zhang, et al.

DATE 2013

Paper

Is 3D chip technology the next growth engine for performance improvement?

Philip G. Emma, Eren Kursun

IBM J. Res. Dev

Conference paper

Analysis and mitigation of lateral thermal blockage effect of through-silicon-via in 3D IC designs

Yibo Chen, Eren Kursun, et al.

ISLPED 2011

Paper

Fast poisson solvers for thermal analysis

Haifeng Qian, Sachin S. Sapatnekar, et al.

ACM TODAES

View all publications

Abstract

Related

Thermomechanical stress-aware management for 3D IC designs

Is 3D chip technology the next growth engine for performance improvement?

Analysis and mitigation of lateral thermal blockage effect of through-silicon-via in 3D IC designs

Fast poisson solvers for thermal analysis