Opportunities and challenges for 3D systems and their design

Philip Emma; Eren Kursun

doi:10.1109/MDT.2009.119

IEEE Design and Test of Computers

Paper

06 Nov 2009

Opportunities and challenges for 3D systems and their design

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Abstract

Editor's note article presents the system design opportunities offered by 3D integration, and it discusses the design and test challenges for 3D ICs, with various new design-for-manufacture and DFT issues. © 2009 IEEE.

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