J.I. Budnick, L.J. Bruner, et al.
Journal of Applied Physics
An investigation of the Bordoni dislocation relaxation peaks in copper has been carried out under experimental conditions which permit plastic deformation of specimens at 4.2°K, with measurement of their Young's modulus and internal friction upon subsequent warmup. Isochronal annealing at progressively higher temperatures in the interval from 100°to 360°K, taking data from 4.2°K after each anneal, shows (a) a pronounced reduction in height of both the major peak at 62°K and the minor peak at 28°K for annealing temperatures to 200°K, (b) a slow regrowth and shift to higher temperature of the major peak with annealing above 200°K, accompanied by continued diminution of the minor peak, and (c) a monotonic increase, through the full range of annealing temperatures, of the Young's modulus as measured at 4.2°K. A qualitative discussion of these results indicates that the interaction between point defects and dislocations is an essential feature of the dislocation relaxation process. © 1963 The American Physical Society.
J.I. Budnick, L.J. Bruner, et al.
Journal of Applied Physics
B.M. Mecs, A.S. Nowick
Applied Physics Letters
E.L. Boyd, J.I. Budnick, et al.
Journal of Applied Physics