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ASME Journal of Electronic Packaging
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Modeling thermal stresses in periodic structures: Some obserwations regarding the boundary conditions

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Abstract

Periodic structures, that is, structures that consist of a basic pattern which is repeated multiple times, are commonplace in the electronics industry. This paper is concerned with the determination of thermal stresses in such structures. Specifically, it is demonstrated that thermal stresses can be computed using a reduced model, if one uses the correct boundary conditions. It is also shown that a reduced model can give very misleading results if incorrect boundary conditions are employed. © 1992 by ASME.

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ASME Journal of Electronic Packaging

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