J.M.E. Harper, C. Cabral Jr., et al.
Journal of Applied Physics
Microscale Laser Shock Peening (LSP) is a technique that can be potentially applied to manipulate the residual stress distributions in metal film structures and thus improve the reliability of micro-devices. This paper reports high-spatial-resolution characterization of shock treated copper thin films on single-crystal silicon substrates, where scanning x-ray microtopography is used to map the relative variation of the stress/strain field with micron spatial resolution, and instrumented nanoindentation is applied to measure the distribution of hardness and deduce the sign of the stress/strain field. The measurement results are also compared with 3-D simulation results. The general trends in simulations agree with those from experimental measurements. Simulations and experiments show that there is a near linear correlation between strain energy density at the film-substrate interface and the X-ray diffraction intensity contrast.
J.M.E. Harper, C. Cabral Jr., et al.
Journal of Applied Physics
Khaled A.S. Abdel-Ghaffar
IEEE Trans. Inf. Theory
Elena Cabrio, Philipp Cimiano, et al.
CLEF 2013
Bowen Zhou, Bing Xiang, et al.
SSST 2008