Raymond F. Boyce, Donald D. Chamberlin, et al.
CACM
Microscale Laser Shock Peening (LSP) is a technique that can be potentially applied to manipulate the residual stress distributions in metal film structures and thus improve the reliability of micro-devices. This paper reports high-spatial-resolution characterization of shock treated copper thin films on single-crystal silicon substrates, where scanning x-ray microtopography is used to map the relative variation of the stress/strain field with micron spatial resolution, and instrumented nanoindentation is applied to measure the distribution of hardness and deduce the sign of the stress/strain field. The measurement results are also compared with 3-D simulation results. The general trends in simulations agree with those from experimental measurements. Simulations and experiments show that there is a near linear correlation between strain energy density at the film-substrate interface and the X-ray diffraction intensity contrast.
Raymond F. Boyce, Donald D. Chamberlin, et al.
CACM
Yigal Hoffner, Simon Field, et al.
EDOC 2004
Rajeev Gupta, Shourya Roy, et al.
ICAC 2006
Marshall W. Bern, Howard J. Karloff, et al.
Theoretical Computer Science