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Publication
IBM J. Res. Dev
Paper
Metallization by plating for high-performance multichip modules
Abstract
Electrolytic plating is used to produce the interconnect wiring on the current generation of high-performance multichip modules used in IBM S/390® and AS/400® servers. This paper reviews the material and manufacturing requirements for successful implementation of a multilayer high-density wiring pattern involving electroplated copper metal and polyimide dielectric. Various strategies for the construction of thin-film structures (planarized and nonplanarized) are outlined, and the advantages of electrolytic plating over dry deposition techniques are described.