William Hinsberg, Joy Cheng, et al.
SPIE Advanced Lithography 2010
Electrolytic plating is used to produce the interconnect wiring on the current generation of high-performance multichip modules used in IBM S/390® and AS/400® servers. This paper reviews the material and manufacturing requirements for successful implementation of a multilayer high-density wiring pattern involving electroplated copper metal and polyimide dielectric. Various strategies for the construction of thin-film structures (planarized and nonplanarized) are outlined, and the advantages of electrolytic plating over dry deposition techniques are described.
William Hinsberg, Joy Cheng, et al.
SPIE Advanced Lithography 2010
N.K. Ratha, A.K. Jain, et al.
Workshop CAMP 2000
Limin Hu
IEEE/ACM Transactions on Networking
Xinyi Su, Guangyu He, et al.
Dianli Xitong Zidonghua/Automation of Electric Power Systems