Michael Ray, Yves C. Martin
Proceedings of SPIE - The International Society for Optical Engineering
Electrolytic plating is used to produce the interconnect wiring on the current generation of high-performance multichip modules used in IBM S/390® and AS/400® servers. This paper reviews the material and manufacturing requirements for successful implementation of a multilayer high-density wiring pattern involving electroplated copper metal and polyimide dielectric. Various strategies for the construction of thin-film structures (planarized and nonplanarized) are outlined, and the advantages of electrolytic plating over dry deposition techniques are described.
Michael Ray, Yves C. Martin
Proceedings of SPIE - The International Society for Optical Engineering
Chidanand Apté, Fred Damerau, et al.
ACM Transactions on Information Systems (TOIS)
Israel Cidon, Leonidas Georgiadis, et al.
IEEE/ACM Transactions on Networking
Donald Samuels, Ian Stobert
SPIE Photomask Technology + EUV Lithography 2007