Ohad Shamir, Sivan Sabato, et al.
Theoretical Computer Science
Electrolytic plating is used to produce the interconnect wiring on the current generation of high-performance multichip modules used in IBM S/390® and AS/400® servers. This paper reviews the material and manufacturing requirements for successful implementation of a multilayer high-density wiring pattern involving electroplated copper metal and polyimide dielectric. Various strategies for the construction of thin-film structures (planarized and nonplanarized) are outlined, and the advantages of electrolytic plating over dry deposition techniques are described.
Ohad Shamir, Sivan Sabato, et al.
Theoretical Computer Science
Preeti Malakar, Thomas George, et al.
SC 2012
Michael D. Moffitt
ICCAD 2009
Inbal Ronen, Elad Shahar, et al.
SIGIR 2009