Wangran Wu, Yu Pu, et al.
Applied Physics Letters
To investigate and understand the reliability behavior of strained silicon devices, the changes of gate currents (I g) and substrate currents (I sub) in n and p-channel metal-oxide-semiconductor field-transistors (MOSFETs) under different types of mechanically applied tensile stresses have been studied. It has been observed that, under the uniaxial tensile stress, both I g and I sub of pMOSFETs increase with the increase of applied stress under the inversion and the accumulation conditions. However, an opposite stress dependence in nMOSFETs has been observed for I g and I sub in both the inversion and the accumulation regimes. Similar changes have been found for I g and I sub of nMOSFETs under biaxial tensile stress. The observations are explained by the strain induced band structure modulation and the repopulation of carriers. © 2012 American Institute of Physics.