Raymond Wu, Jie Lu
ITA Conference 2007
In metallized ceramic technology substantial mechan cal stresses arise in assembly, insertion and cyclic thermal loading of thermally enhanced modules. This paper describes some experimental and analytical investigations performed for safeguarding the structural integrity of modules in which heat conduction from the chip to the module cap was enhanced by a “thermal grease” compound. © 1989 ASME.
Raymond Wu, Jie Lu
ITA Conference 2007
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ASP-DAC 2008
S.F. Fan, W.B. Yun, et al.
Proceedings of SPIE 1989
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SC 2012