Publication
ASME Journal of Electronic Packaging
Paper

Mechanical analysis for thermal grease enhanced modules enclosing a silicon chip

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Abstract

In metallized ceramic technology substantial mechan cal stresses arise in assembly, insertion and cyclic thermal loading of thermally enhanced modules. This paper describes some experimental and analytical investigations performed for safeguarding the structural integrity of modules in which heat conduction from the chip to the module cap was enhanced by a “thermal grease” compound. © 1989 ASME.

Date

01 Jun 1989

Publication

ASME Journal of Electronic Packaging

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