About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Paper
Localized electrodeposition induced by Joule heat at a constriction
Abstract
We report a novel localized electrodeposition process based on localized Joule heating at a constriction and the temperature dependence of the equilibrium potential at a metal-electrolyte interface. Assuming a local temperature rise of 50 K, a deposition rate as high as 2 μm per minute of copper is theoretically predicted in acidified copper sulfate solution, which is verified by a series of experiments. Scanning electron microscopy micrographs show that the deposited copper is dense and crystalline. As an immediate application of this novel phenomenon, a method of self-induced repair for incipient opens, i.e., a self-locating and self-terminating process to treat constrictions in circuits, is established.