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Publication
Applied Physics Letters
Paper
Laser writing of copper lines from metalorganic films
Abstract
Direct writing of high-purity copper lines has been achieved by photothermal decomposition of copper formate films under ambient conditions using a focused argon ion laser (514 nm) beam on a scanning quartz or silicon substrate. The fast decomposition kinetics of the precursor allows use of writing speeds as high as 1 cm/s for deposition of micron-thick copper films. There is negligible oxidation of the copper after decomposition in the presence of air due to the rapid heating and cooling of the deposit during laser writing.