PaperKinetics of thermal and acid-catalyzed deprotection in deep-UV resist materialsG.M. Wallraff, John M. Hutchinson, et al.Microelectronic Engineering
PaperMetal-containing release layers for use with UV-cure nanoimprint lithographic template materialsF.A. Houle, S. Raoux, et al.Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
PaperLCVD of copper: Deposition rates and deposit shapesC.R. Moylan, T.H. Baum, et al.Applied Physics A Solids and Surfaces
PaperSurface processes leading to carbon contamination of photochemically deposited copper filmsF.A. Houle, R.J. Wilson, et al.JVSTA