Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Paper

01 Jul 1987

Kinetics of high-temperature thermal decomposition of Si0 2 on Si(100)

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Abstract

No abstract available.

Paper

On boundary conditions in lattice Boltzmann methods

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Physics of Fluids

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NEW RELIABLE STRUCTURE FOR HIGH TEMPERATURE MEASUREMENT OF SILICON WAFERS USING A SPECIALLY ATTACHED THERMOCOUPLE.

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MRS Proceedings 1983

Paper

Electrochemical characterization of adsorption-desorption of the cuprous-suppressor-chloride complex during electrodeposition of copper

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JES

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Formation mechanism and suppression methods of copper dendrites in BEOL integration

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ADMETA 2011

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