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Semiconductor Science and Technology
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Interdiffusion in strained Si/strained SiGe epitaxial heterostructures

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Abstract

The Si-Ge interdiffusivity in epitaxial strained Si/Si1-yGey/strained Si/relaxed Si1-x0Gex0 and strained Si/relaxed Si 1-x0Gex0 heterostructures is investigated for Ge fractions between 0 and 0.56 over the temperature range of 770-920 °C. Si-Ge interdiffusivity is found to increase by 2.2× for every 10% increase in local Ge fraction for interdiffusion in strained Si/relaxed SiGe structures. Significantly enhanced Si-Ge interdiffusion is observed in structures with Si1-yGey layers under biaxial compressive strain. The interdiffusivity increases by 4.4× for every 0.42% increase in the magnitude of biaxial compressive strain. These results were incorporated into an interdiffusion model that successfully predicts the interdiffusion in epitaxial SiGe heterostructures. © 2007 IOP Publishing Ltd.

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Semiconductor Science and Technology

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