About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
IEEE Transactions on Magnetics
Paper
Integrated multi-turn thin film recording head
Abstract
This paper will discuss the design and fabrication of multi-turn heads for digital data recording. Separate read and write elements are fabricated side-by-side, with separately optimized track width (50 and 100 microns), pole thickness (1 and 4 microns), and gap thickness (1 and 2 microns). The windings consist of an 8 turn bifilar, planar spiral of copper which has been electroplated through a photoresist mask. The permalloy layers are composed of 81:19 NiFe, electroplated through a photoresist window-frame pattern designed to insure uniform NiFe composition across the pattern. Insulation was fabricated from baked photoresist, which provides leveling over the high aspect ratio winding conductors. An oxidized silicon substrate and cover piece formed the air-bearing slider. Heads have been fabricated with a glass layer laminated within each permalloy leg to control closure domains. Bitter patterns demonstrating the effect of these laminations have been obtained. The heads have been flown and tested on a particulate disk. © 1979 IEEE