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Publication
MRS Spring Meeting 1993
Conference paper
Increase in period of oscillatory coupling in Cu by doping with Ni
Abstract
The origin of oscillatory interlayer coupling via Cu is explored in sputtered Co/Cu multilayer by varying the hole concentration in the copper layers by doping with elements of different valence. Detailed studies were carried out for a series of Cu-Ni alloys. The oscillation period of pure Cu is observed to increase monotonically with increasing Ni concentration and is almost doubled for 40 atomic % Ni. The increase in oscillation period can be accounted for by considering changes in the topology of the Fermi surface of the alloy resulting from the change in band filling.