About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
ACS AMI
Paper
Heterogeneous solution deposition of high-performance adhesive hybrid films
Abstract
Interfaces between organic and inorganic materials are of critical importance to the lifetime of devices found in microelectronic chips, organic electronics, photovoltaics, and high-performance laminates. Hybrid organic/inorganic materials synthesized through sol-gel processing are best suited to address these challenges because of the intimate mixing of both components. We demonstrate that deposition from heterogeneous sol-gel solutions leads to the unique nanolength-scale control of the through-thickness film composition and therefore the independent optimization of both the bulk and interfacial film properties. Consequently, an outstanding 3-fold improvement in the adhesive/cohesive properties of these hybrid films can be obtained from otherwise identical precursors. © 2013 American Chemical Society.