Conference paperBuilding a packaging hierarchy for optical interconnects using polymer waveguides: Exploring the optionsStephen L. Buchwalter, Russell Budd, et al.GBC 2006
PaperEffects of mechanical stress and moisture on packaging interfacesStephen L. Buchwalter, Peter J. Brofman, et al.IBM J. Res. Dev
PaperCleavable epoxy resins: Design for disassembly of a thermosetStephen L. Buchwalter, Laura L. KosbarJ Polym Sci Part A
PaperDevelopment of conductive adhesive materials for via fill applicationsSung K. Kang, Stephen L. Buchwalter, et al.IEEE Transactions on Components and Packaging Technologies
