Publication
JES
Paper

Fabrication Processes for a Silicon Substrate Package for Integrated Gallium Arsenide Laser Arrays

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Abstract

Single crystal silicon substrate chips with preferentially etched V-groove structures have been fabricated to accurately hold optical fibers for efficient output coupling of integrated gallium arsenide laser arrays. In addition, the substrate contains individually addressable drive electrodes electrically isolated by reversed biased p-n junctions. This paper discusses the required fabrication and processing techniques necessary to achieve the silicon package utilizing batch-processing technology found in the manufacture of microelectronic devices. © 1978, The Electrochemical Society, Inc. All rights reserved.

Date

09 Dec 2019

Publication

JES

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