Conference paperNEW RELIABLE STRUCTURE FOR HIGH TEMPERATURE MEASUREMENT OF SILICON WAFERS USING A SPECIALLY ATTACHED THERMOCOUPLE.S. Cohen, T.O. Sedgwick, et al.MRS Proceedings 1983
Conference paperFormation mechanism and suppression methods of copper dendrites in BEOL integrationShaoning Yao, Wei-Tsu Tseng, et al.ADMETA 2011
PaperA surface core-level shift photoemission study of the interaction of oxygen with W{100}P. Alnot, D.J. Auerbach, et al.Surface Science
Conference paperGrowth and transport properties of multilayer superconducting films of Nd1.83Ce0.17CuOx / YBa2Cu3O7-δA. Gupta, R. Gross, et al.SPIE Advances in Semiconductors and Superconductors 1990
