Calvin R. King Jr., Deepak Sekar, et al.
ECTC 2008
It is well known that electromigration (EM) time-to-failure for ac is several orders of magnitude larger than for dc. We propose a novel technique that reverses current direction in the power delivery system of a microprocessor every time it is rebooted. This improves EM time-to-failure of solder bumps and on-chip global interconnects and vias in the power delivery system. © 2007 IEEE.
Calvin R. King Jr., Deepak Sekar, et al.
ECTC 2008
Deepak Sekar, Calvin King, et al.
IITC 2008
Vince S. Siu, Minhua Lu, et al.
Biosensors
Bing Dang, Da-Yuan Shih, et al.
ECTC 2008