Electroless metal discharge layers for electron beam lithography

Abstract

A study was performed on electroless metal discharge layers for electron beam lithography. A method for fabrication of continuous, conformal, ultrathin Cu films using a room temperature, aqueous-based, electroless deposition technique on silica and polymer planarizer surfaces was reported. It was found that Cu films are electrically conductive, sufficiently homogeneous and optically transparent for use as resist discharge layers during e-beam patterning of the substrate.