Electrical interconnect design for testing of high-speed IC transceivers

Abstract

This paper discusses the requirements and challenges associated with the design of electrical interconnects to support the test and evaluation of high-speed transceivers working up to 40 Gb/s. It will be shown that relatively low cost technologies such as FR-4 boards, push-on connectors, and wire bonding can effectively achieve this goal. A specific platform and its application for testing of a 40-Gb/s VCSEL-based optoelectronic link are presented. © 2012 IEEE.