Conference paper
Principles for physical-based gridding of package structures
Barry J. Rubin
IEEE Topical Meeting EPEPS 2006
In this paper we discuss the electrical and physical properties of interconnection structures that impact the performance of computer systems. These considerations are illustrated with three examples of such devices found in a typical mainframe. The requirements for the future are then presented. The ability of new technologies, electrical and optical, for satisfying these requirements is discussed. © Taylor & Francis Group, LLC.
Barry J. Rubin
IEEE Topical Meeting EPEPS 2006
G. Arjavalingam, P.G. May, et al.
Proceedings of SPIE 1989
Y. Pastol, G. Arjavalingam, et al.
Applied Physics Letters
S.Y. Lin, G. Arjavalingam
Journal of the Optical Society of America B: Optical Physics