L. Efrat, M. Tismenetsky, et al.
ECTC 1993
In this paper we discuss the electrical and physical properties of interconnection structures that impact the performance of computer systems. These considerations are illustrated with three examples of such devices found in a typical mainframe. The requirements for the future are then presented. The ability of new technologies, electrical and optical, for satisfying these requirements is discussed. © Taylor & Francis Group, LLC.
L. Efrat, M. Tismenetsky, et al.
ECTC 1993
Barry J. Rubin
IEEE Trans Antennas Propag
W. Robertson, G. Arjavalingam, et al.
Journal of Applied Physics
A. Deutsch, G. Arjavalingam, et al.
ECTC 1994