Joel L. Wolf, Mark S. Squillante, et al.
IEEE Transactions on Knowledge and Data Engineering
Paper
Elastoplastic analysis of bimaterial beams subjected to thermal loads
Abstract
The problem of determining the stresses in a bimaterial beam subjected to a thermal load is considered. One beam layer is assumed to be linear while the second layer is assumed to be elastoplastic. A simple analytical solution is derived and compared against results obtained with finite elements. © 1991 by ASME.
Related
Rajiv Ramaswami, Kumar N. Sivarajan
IEEE/ACM Transactions on Networking
M.F. Cowlishaw
IBM Systems Journal
J.P. Locquet, J. Perret, et al.
SPIE Optical Science, Engineering, and Instrumentation 1998