Publication
ASME Journal of Electronic Packaging
Paper

Elastoplastic analysis of bimaterial beams subjected to thermal loads

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Abstract

The problem of determining the stresses in a bimaterial beam subjected to a thermal load is considered. One beam layer is assumed to be linear while the second layer is assumed to be elastoplastic. A simple analytical solution is derived and compared against results obtained with finite elements. © 1991 by ASME.

Date

01 Dec 1991

Publication

ASME Journal of Electronic Packaging

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