About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
Acta Metallurgica Et Materialia
Paper
Effects of surface and boundary diffusion on void growth
Abstract
The coupled equations for boundary and surface diffusion that control the growth of a void along a grain boundary have been solved numerically for the limiting case where the slope of the cavity surface is always small. The resulting solutions are compared with asymptotic results for the same problem that have been developed earlier by other authors. It is shown that existing expressions for "crack-like" and "quasi-equilibrium" growth provide an excellent description of void growth over the entire range of possible conditions. The numerical results illustrate the transition between the two modes and the evolution of the cavity profile during growth. In particular, a wedge-shaped cavity is predicted to develop as a void grows across a grain boundary, even in the absence of crystallographic effects. © 1995.