Variable transmission lines: Structure and compact modeling
Shlomo Shlafman, David Goren, et al.
COMCAS 2011
This paper presents a design and modeling methodology of vertical interconnects for three-dimensional integration (3DI) applications. Compact semi-analytical wideband circuit level models have been developed based on explicit expressions. The pronounced frequency dependent silicon substrate induced dispersion and loss effects are considered, as well as skin and proximity effects. The models have been verified against numerical computations (full wave HFSS and quasi-static Q3D solvers). A dedicated test site has been designed for broadband characterization (from 1 MHz up to 110 GHz) of TSVs within a dense farm. © 2011-2012 IEEE.
Shlomo Shlafman, David Goren, et al.
COMCAS 2011
Naigang Wang, David Goren, et al.
IEDM 2014
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SiRF 2006
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IEEE Transactions on CPMT