Curved in-plane electromechanical relay for low power logic applications

Abstract

A curved design for in-plane micro- and nano-electromechanical switches based on a single clamped cantilever is proposed, optimized with finite-element simulations and demonstrated experimentally. The design enables precise control of the switch motion and of the closed-state air gap, resulting in a uniform electrostatic field and increased robustness. The switch size and curvature are optimized for actuation voltage, actuation energy and the electrostatic field strength. These optimizations and the proposed fabrication process are amenable to micro- and nano-electromechanical switches. The scalability of the concept is demonstrated with simulations of nanoscale relays in terms of force and energy, showing that the concept is suitable for sub-100 aJ switching energy. Experimental results on microscale devices demonstrate the advantages of the curved MEM switches, namely a fabrication process with a single sacrificial layer for a switch with a low actuation voltage and excellent robustness. The designed as well as the experimentally observed breakdown voltage is four times higher than the contact voltage, thus enabling a large operating window for electromechanical switches. © 2013 IOP Publishing Ltd.