Julian J. Hsieh
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
The history and evolution of electron beam based contactless multichip module (MCM) test technology at IBM is described. The feasibility of a new contactless test method based on opens and shorts detection by means of the measurement of net capacitance is demonstrated. A case is given for the economic viability of a tester based on this technique.
Julian J. Hsieh
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
K.N. Tu
Materials Science and Engineering: A
Elizabeth A. Sholler, Frederick M. Meyer, et al.
SPIE AeroSense 1997
L.K. Wang, A. Acovic, et al.
MRS Spring Meeting 1993