P. Martensson, R.M. Feenstra
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
A compact modeling approach for silicon-chip slow-wave transmission lines with slotted bottom metal ground planes is studied and its limitations are presented. The modeling approach facilitates the calculation of the slow-wave transmission line parameters based upon the corresponding coplanar and grounded coplanar transmission-line parameters. The described analysis method is used for a comparative study of the slow-wave structures versus their coplanar and grounded coplanar reference structures. Floating bottom shield slow-wave transmission lines are then compared with their grounded bottom shield counterparts. The theoretical results are supported by electromagnetic simulations and by measurements up to 30 and 50 GHz. © 2006 IEEE.
P. Martensson, R.M. Feenstra
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
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MRS Spring Meeting 1999
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