Polymer Engineering & Science

Bubble formation mechanism during heat treatment of polymer films cast from solutions

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A semiquantitative bubble formation mechanism is presented for the baking of polymer films, utilizing poly(methyl methacrylate) (PMMA)‐ethyl acetate (EA) solutions as the model system. It is shown that bubble growth phenomena can he accounted for in terms of the competition between vapor pressure buildup and the rate of vapor dissolution. According to the proposed mechanism, the local pressure buildup of solvent in the polymer film is controlled by the solvent partial pressure above a solution having a planar interface at the corresponding temperature and solvent concentration. This pressure can he estimated by Raoult's law. The vapor dissolution rate, on the other hand, is dominated by the liquid‐phase diffusion of the solvent. A method of obtaining the diffusion coefficient as a function of temperature and solvent concentration from isothermal thermogravimetric analysis (TGA) is also given. Copyright © 1985 Society of Plastics Engineers, Inc.


25 Aug 2004


Polymer Engineering & Science