About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
ANTEC Annual Technical Conference 1994
Conference paper
Applications of rheology in the computer industry
Abstract
Liquid crystal polymers were studied for circuit board applications. Solder paste rheology was found to be a useful measure of solder paste performance. In the area of hot melt adhesives, rheological tests were employed in specifying a blend with improved melt flow properties and solubility. Time-temperature superposition was employed to predict lifetime from accelerated life test data. The characteristic time of disk lubricants was measured to help explain the results of tribological testing. Overall, rheology plays a key role in the development of new materials for the computer industry.