Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperAb initio molecular dynamics simulation of liquids and solutionsMichiel SprikJournal of Physics Condensed Matter
PaperShear and time-dependent rheology of a fully nematic thermotropic liquid crystalline copolymerDouglass S. Kalika, David W. Giles, et al.Journal of Rheology
PaperCurrent saturation in submicrometer graphene transistors with thin gate dielectric: Experiment, simulation, and theoryShu-Jen Han, Dharmendar Reddy, et al.ACS Nano
