Xikun Hu, Wenlin Liu, et al.
IEEE J-STARS
Selective protection of the porosity can be implemented in porous materials processing by using an organic polymer fill. This strategy is employed to protect ultralow-k (ULK) materials during patterning of 250-nm lines and spaces. Structures with significantly less sidewall and trench bottom damage are obtained, proving the potential of this novel approach in materials science. Copyright © 2011 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
Xikun Hu, Wenlin Liu, et al.
IEEE J-STARS
Thomas H. Baum, Carl E. Larson, et al.
Journal of Organometallic Chemistry
J. Tersoff
Applied Surface Science
Kigook Song, Robert D. Miller, et al.
Macromolecules