Conference paperSelf-assembling materials for lithographic patterning: Overview, status and moving forwardWilliam Hinsberg, Joy Cheng, et al.SPIE Advanced Lithography 2010
Conference paperInvestigation of the numerical accuracy of transmission line-based transient analysis of high-speed interconnects and cablesAndreas C. Cangellaris, Karen M. Coperich, et al.EMC 2001
Conference paperNEW RELIABLE STRUCTURE FOR HIGH TEMPERATURE MEASUREMENT OF SILICON WAFERS USING A SPECIALLY ATTACHED THERMOCOUPLE.S. Cohen, T.O. Sedgwick, et al.MRS Proceedings 1983
Conference paperCharacterization of thin dielectric films as copper diffusion barriers using triangular voltage sweepS. Cohen, J.C. Liu, et al.MRS Spring Meeting 1999
