Conference paper
Learning Reduced Order Dynamics via Geometric Representations
Imran Nasim, Melanie Weber
SCML 2024
Near-ternary eutectic Sn-Ag-Cu alloys are leading lead-free candidate solders for various applications. These alloys yield three phases upon solidification: β-Sn,Ag3Sn, and Cu6Sn5. Large, plate-like, pro-eutectic Ag3Sn structures can grow rapidly within the liquid phase, potentially adversely affecting the mechanical behavior and reducing the fatigue life of solder joints. This article reports on the formation of such plates in Sn-Ag-Cu solder balls and joints and demonstrates how large Ag3Sn plate formation can be minimized.
Imran Nasim, Melanie Weber
SCML 2024
Michiel Sprik
Journal of Physics Condensed Matter
Shaoning Yao, Wei-Tsu Tseng, et al.
ADMETA 2011
A. Reisman, M. Berkenblit, et al.
JES