Ag₃Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu

Abstract

Near-ternary eutectic Sn-Ag-Cu alloys are leading lead-free candidate solders for various applications. These alloys yield three phases upon solidification: β-Sn,Ag3Sn, and Cu6Sn5. Large, plate-like, pro-eutectic Ag3Sn structures can grow rapidly within the liquid phase, potentially adversely affecting the mechanical behavior and reducing the fatigue life of solder joints. This article reports on the formation of such plates in Sn-Ag-Cu solder balls and joints and demonstrates how large Ag3Sn plate formation can be minimized.