Victor Valls, Panagiotis Promponas, et al.
IEEE Communications Magazine
The paper reviews our recent progress and current challenges in implementing advanced gate stacks composed of high-κ dielectric materials and metal gates in mainstream Si CMOS technology. In particular, we address stacks of doped polySi gate electrodes on ultrathin layers of high-κ dielectrics, dual-workfunction metal-gate technology, and fully silicided gates. Materials and device characterization, processing, and integration issues are discussed. © Copyright 2006 by International Business Machines Corporation.
Victor Valls, Panagiotis Promponas, et al.
IEEE Communications Magazine
Elizabeth A. Sholler, Frederick M. Meyer, et al.
SPIE AeroSense 1997
Raghu Krishnapuram, Krishna Kummamuru
IFSA 2003
Xinyi Su, Guangyu He, et al.
Dianli Xitong Zidonghua/Automation of Electric Power Systems