Publication
IEEE JSSC
Paper

Accurate Metallization Capacitances for Integrated Circuits and Packages

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Abstract

The parallel-plate formula is widely used by the solid-state circuit designer to estimate capacitances in integrated circuits. Since considerable errors may result from using this approximation, this correspondence gives correction curves for a wide range of parameters. It is shown that the finite conductor thickness may significantly contribute to the increase in capacitance. Copyright š 1973 by The Institute of Electrical and Electronics Engineers, Inc.

Date

01 Jan 1973

Publication

IEEE JSSC

Authors

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