A 60GHz radio chipset fully-integrated in a low-cost packaging technology

Abstract

We present a cost-effective plastic packaging technology for a fully-integrated 60GHz radio, used for communication in the 60GHz ISM band. The chipset supports 1-3 Gbps directional links using a ASK or PSK modulation, or it can be used in 500Mbps-1Gbps omni-directional links using an OFDM modulation. The antenna is integrated inside of the package and does not require any high-frequency external connection. The fabrication process of a direct-chip-attach (DCA) and surface mountable land-grid-airay (LGA) package technology is presented. Both packages are robust against variations of the electrical properties of standard plastic mold materials. ©2006 IEEE.