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Research

Curtis Grosskopf

Title

STSM - Supply Chain Engr, Components: IC Packaging, Pkg/PWB interaction, RoHS issues, JEDEC JC14.4 chair
Curtis Grosskopf

Bio

Senior Technical Staff Member, IBM Supply Chain Engineering, -35+ years IC packaging and electronic component assembly  -2nd level interaction between electronic components and PWB assembly processes

  • Technical lead for IBM Supply Chain Engineering team for environmental (RoHS, REACH, PFAS, etc.) and Pb-free issues
  • Chairman JEDEC JC14.4 - Quality Systems
  • Co-chair IPC 2-15f - Obsolete and Discontinued Products
  • 35+ years involvement in generation of IPC and JEDEC industry standards

Patents

Projects