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- 2021
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Conference paper
Publications
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Plasma Activated Low-temperature Die-level Direct Bonding with Advanced Wafer Dicing Technologies for 3D Heterogeneous Integration
- Katsuyuki Sakuma
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- et al.
- 2021
- ECTC 2021
Conference paperCo-package technology platform for low-power and low-cost data centers
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- 2021
- Applied Sciences
PaperDatashim and its applications in Bioinformatics
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- 2021
- VHPC 2021
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- 2021
- DRC 2021
Conference paperDither computing: a hybrid deterministic-stochastic computing framework
- 2021
- ARITH 2021
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- Vijayalakshmi Srinivasan
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- 2021
- ISCA 2021
Conference paperEnabling Next Generation CMOS by Novel EOT Scaling Module
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- 2021
- VLSI Technology 2021
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- P. Bhosale
- N. Lanzillo
- et al.
- 2021
- VLSI Technology 2021
Conference paperFully on-chip MAC at 14nm enabled by accurate row-wise programming of PCM-based weights and parallel vector-transport in duration-format
- P. Narayanan
- S. Ambrogio
- et al.
- 2021
- VLSI 2021
Conference paper