Full Bottom Dielectric Isolation to Enable Stacked Nanosheet Transistor for Low Power and High Performance Applications
- J. Zhang
- S. Pancharatnam
- et al.
- 2019
- IEDM 2019
Publications
Date
Featured collections
Popular topics
- Semiconductors
747 results for Semiconductors
Digitalization concepts to optimize O&M strategies in Offshore Wind Energy
- Michael Nidd
- Moritz Gräfe
- et al.
- 2019
- WindEurope Offshore 2019
Weight Programming in DNN Analog Hardware Accelerators in the Presence of NVM Variability
- Charles Mackin
- Sidney Tsai
- et al.
- 2019
- Advanced Electronic Materials
Directed self-assembly of block copolymers for 7 nanometre FinFET technology and beyond
- Charlie Liu
- Elliott Franke
- et al.
- 2018
- Nature Electronics
Qiskit Backend Specifications for OpenQASM and OpenPulse Experiments
- David McKay
- Thomas Alexander
- et al.
- 2018
- arXiv
Detection of Printable EUV Mask Absorber Defects and Defect Adders by Full Chip Optical Inspection of EUV Patterned Wafers
- Luciana Meli
- Ravi Bonam
- et al.
- 2017
- IEEE Trans Semicond Manuf
Control and Implementation Aspects of a Multiphase Inductor-Based FIVR in 14 nm Bulk CMOS for Microprocessor Applications
- Riduan K. Aljameh
- Pedro A. M. Bezerra
- et al.
- 2016
- PwSoC 2016
Proposal of Package Structure Requirements for Effective Cooling from the Bottom Side of Chips (from the Substrate Side), Aiming for a Three-Dimensional (3D) Chip Stack
- Keiji Matsumoto
- Hiroyuki Mori
- 2016
- ECTC 2016
Detection of printable EUV mask absorber defects and defect adders by full chip optical inspection of EUV patterned wafers
- Luciana Meli
- Scott D. Halle
- et al.
- 2016
- ASMC 2016
Most Probable Paths to Data Loss: An Efficient Method for Reliability Evaluation of Data Storage Systems
- Ilias Iliadis
- Vinodh Venkatesan
- 2015
- International Journal on Advances in Systems and Measurements