A Switched-Capacitor Integer Compute Unit with Decoupled Storage and Arithmetic for Cloud AI Inference in 5nm CMOS
- Ankur Agrawal
- Monodeep Kar
- et al.
- 2023
- VLSI Technology 2023
Conference paper
Publications
300 results for AI Hardware
Contact Cavity Shaping and Selective SiGe:B Low-Temperature Epitaxy Process Solution for sub 10-9 Ω.cm2 Contact Resistivity in Nonplanar FETs
- N. Breil
- B.-C. Lee
- et al.
- 2023
- VLSI Technology 2023
Conference paperProactive Power Regulation with Real-time Prediction and Fast Response Guardband for Fine-grained Dynamic Voltage Droop Mitigation on Digital SoCs
- Xi Chen
- Jiaxiang Feng
- et al.
- 2023
- VLSI Technology 2023
Conference paperBenchmarking novel AI accelerators: striving to be both fair and comprehensive
- 2023
- VLSI Technology 2023
Workshop paperIn-memory computing for accelerating deep neural networks and neuro-vector-symbolic architectures
- 2023
- AICAS 2023
Tutorial1.65 µm L/S high density interconnect on organic substrate by advanced semi-additive process for HPC applications
- Hussein Hamieh
- Juliano Borges
- et al.
- 2023
- ECTC 2023
Conference paperDevelopment of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging
- Juliano Borges
- Maxime Darnon
- et al.
- 2023
- ECTC 2023
Conference paperOn the path to AI hardware via chiplet integration enabled by high density organic substrates
- Griselda Bonilla
- Brian Quinlan
- et al.
- 2023
- ECTC 2023
Conference paperComparison of sintering methodologies for 3D printed high-density interconnects (2.3 µm L/S) on organic substrates for high-performance computing applications
- Shrivani Pandiya
- Serge Ecoffey
- et al.
- 2023
- ECTC 2023
Conference paperModeling of the Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D Packages
- Prabudhya Roy Chowdhury
- Sathya Raghavan
- et al.
- 2023
- ECTC 2023
Conference paper