Publications

A Microstructural Investigation of Sub-1 μm Copper Bonding Contact Structures in Die-to-Wafer Hybrid Bonding
- - Sari Zerey
  - Junghyun Cho
  - et al.
- 2024
- ECTC 2024
Ultra-Compact Computing at the Edge Involving Unobtrusively Small Sub-millimeter Heterogeneous Integration Packaging
- - Frank Libsch
  - Steve Bedell
  - et al.
- 2024
- ECTC 2024
Electromigration Kinetics of SAC/SnBiAg Hybrid Solder
- - Minhua Lu
  - Evan Colgan
- 2024
- ECTC 2024
Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 μm-Pitch Solder Joints
- - Akihiro Horibe
  - Takahito Watanabe
  - et al.
- 2024
- ECTC 2024
Witness Semantic Security
- - Paul Lou
  - Nathan Manohar
  - et al.
- 2024
- Eurocrypt 2024
Taming subnet-drift in D2D-enabled fog learning: a hierarchical gradient tracking approach
- - Evan Chen
  - Shiqiang Wang
  - et al.
- 2024
- INFOCOM 2024
Understanding and Bridging the Gap Between Unsupervised Network Representation Learning and Security Analytics
- - Jiacen Xu
  - Xiaokui Shu
  - et al.
- 2024
- S&P 2024
Asterisk: Super-fast MPC with a Friend
- - Banashri Karmakar
  - Nishat Koti
  - et al.
- 2024
- S&P 2024
SyzGen++: Dependency Inference for Augmenting Kernel Driver Fuzzing
- - Weiteng Chen
  - Yu Hao
  - et al.
- 2024
- S&P 2024
LLMs Cannot Reliably Identify and Reason About Security Vulnerabilities (Yet?): A Comprehensive Evaluation, Framework, and Benchmarks
- - Saad Ullah
  - Mingji Han
  - et al.
- 2024
- S&P 2024