Publication
OFC 2015
Conference paper

Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability

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Abstract

We demonstrate silicon photonic packaging that can be fully exercised in existing microelectronic packaging facilities. We show low optical loss and point towards notably improved assembly cost and scalability in both volume and optical port-count.

Date

13 Mar 2015

Publication

OFC 2015

Authors

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